鴻浩科技有限公司Hong how Technology Co., Ltd.
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半導體IC封裝材料:Spin Coating Type
半導體IC封裝材料:Dry Film Roller Type DAF
電子材料:
產品製程工藝簡介... (1) Wafer Backside Spin Coating Die Attach Material Process 1.Full Auto Wafer Backside Coating Process Youtube : https://www.youtube.com/watch?v=ZnaB3XZ3EOE Youku : http://v.youku.com/v_show/id_XNTAxMDc0MzMy.html?spm=a2hzp.8253869.0.0 2.Semi-Auto Wafer Backside Coating Process Youtube: Silver Conductivity Spray Spin Coating https://www.youtube.com/watchv=UXuVS5G8sqE&feature=youtu.be Non-Conductivity Spray Spin Coating https://www.youtube.com/watch?v=F3zMkxDeFfw
Youku:
(2) Wafer Backside Roller Type Pre Cut DAF Lamination Process 1. 8inch Wafer Backside Coating Roller Type DAf Lamination Process Youtube : https://www.youtube.com/watch?v=WY0Yai8SwrY Youku: http://v.youku.com/v_show/id_XMjY5Mzc3NDUwNA==.html?spm=a2hzp.8244740.userfeed.5!7~5~5~5!3~5~A
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